Global semiconductor equipment import regulations in 2025 presentRefined technology controlsandStricter origin reviewsdual trends. The latest U.S. BIS export control list has added 12 categories of wafer manufacturing equipment, the EU CE certification has introduced semiconductor-specific equipment safety standard EN 50598-2025, and mainland China has implemented an import filing system for equipment with process nodes below 28nm. Importers should pay special attention to:
Verification of equipment technical parameters against control lists
Application scenarios of mixed origin rules from multiple countries
ASML equipment from the Netherlands falls under Category 3 control of the Wassenaar Arrangement
Key control points in the customs clearance process
Semiconductor equipment imports involve15 core processes, among which 3 key nodes are prone to cause clearance delays:
Pre-classification disputes: HS code classification disputes for lithography machines between 8486.20 and 8543.70
Technical document compliance: Requires preparation of three sets of technical documents: equipment structure diagrams, electrical schematics, and software architecture descriptions
On-site inspection response: Customs conducts 100% physical inspections on sensitive components such as vacuum chambers and laser generators
Practical guide to tariff optimization and compliance management
Differentiated strategies are recommended for different equipment types:
Wafer manufacturing equipment should prioritize the ECFA Early Harvest Program
Packaging and testing equipment can apply for tax reductions under the National Encouraged Industries Catalog,
Used equipment imports require equipment condition assessment reports issued by Japans JEITA or U.S. SEMI
Analysis of Typical Risk Cases
A Shenzhen chip company encountered clearance obstacles when importing etching machines in March 2025:
Issue: The equipment software version was not within the scope of the import license filing
Loss: Demurrage fees + penalty fees exceeding 20,000 yuan per day